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Q²M Compound is a cutting polishing compound paste, delivering excellent performance and a high level of scratch removal combined with a very low level of dust and an incomparable finish.
A significant level of cutting power comes with an impressively low dust level and high quality finish. Q²M Compound formula is water-based and contains high quality Japanese abrasives, allowing great results in just one cutting paste.
No silicone or fillers make the procedure of pre-coating preparation and polish removal much easier and quicker.
Q²M Compound is a magnificent one step product while used with an eccentric polisher and the Q²M Eccentric Polish Pad. This technique will allow decent defect removal and a great, glossy finish.
CONSUMPTION: 15-40ML/PANEL
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